"We are pleased to work with NEC on this project and look forward to further collaboration in the future", stated John Hamill, Asetek Chief Operating Officer. "Partnering with leading OEMs such as NEC is a cornerstone of our strategy to develop the emerging data centre market."
"Liquid cooling technology is becoming a key supercomputer component. Asetek's direct-to-chip technology enables more effective cooling and increased computational performance in high density HPC clusters, adding value for our end-users", stated Noritaka Hoshi, Senior Manager, NEC Corporation.
Asetek RackCDU D2C is a hot water liquid cooling solution that captures between 60% and 80% of server heat, reducing data center cooling cost by over 50% and allowing 2.5x-5x increases in data centre server density.